High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends
Abstract: The applications of wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) in power modules are currently limited by the thermal stability of ...
Ilia Malinin hadn't finished outside of first place in any figure skating events he's competed in for multiple years. And while it wasn't the most important one he'll have at the 2026 Winter Olympics, ...
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