Ajinomoto build-up film (ABF) substrate has been a key component in chip manufacturing since its introduction shortly before the turn of the millennium. Substrates made with Ajinomoto build-up film – ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

STMicroelectronics and Soitec have announced the next stage of their cooperation on silicon carbide (SiC) substrates, with the qualification of Soitec's SiC substrate technology by ST planned over the ...

Achieving the auto industry’s stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as ...

Tessera Inc., a designer of chip-scale packaging, has sold its single- and two-metal flexible circuit substrate manufacturing operations in San Jose to Sunright, a burn-in and test service provider.

Sawnics announced a process design kit (PDK) based on Soitec’s Connect piezo-on-insulator (POI) substrates to accelerate RF filter design for 5G smartphones. The South Korean foundry, with expertise ...