Offered in both silicon and silicon carbide versions, Microchip’s SP1F and SP3F power modules now come with press-fit terminals for high-volume applications. Press-fit terminals enable solder-free PCB ...
Why board-level standardization of FPGA implementations matter. What the Harmonized FPGA Module (HFM) standard entails. How semiconductor manufacturers, embedded module manufacturers, VARs, system ...
Jack Zhang, director of sales and marketing Middle East at JA Solar. Image: JA Solar. JA Solar is looking to capitalise on strong demand for modules in the Middle East as developers plan ever-larger ...
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